技术参数

• Package / Case 100-UFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 100MHz, 150MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 512K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M0+, ARM® Cortex®-M4F
• Data Converters A/D 16x10b, 16x12b SAR; D/A 2x7b
• Core Size 32-Bit Dual-Core
• Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V
• Connectivity I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSP, UART/USART, USB
• Peripherals Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, LVD, PMC, POR, PWM, SHA, Temp Sensor, TRNG, WDT
• Supplier Device Package 100-WLCSP (4.11x3.9)
• Number of I/O 82
• DigiKey Programmable Not Verified
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant