技术参数

• Package / Case MicroSMP
• Mounting Type Surface Mount
• Speed Fast Recovery =< 500ns, > 200mA (Io)
• Technology Schottky
• Capacitance @ Vr, F 60pF @ 4V, 1MHz
• Current - Average Rectified (Io) 2A
• Supplier Device Package MicroSMP (DO-219AD)
• Operating Temperature - Junction -40°C ~ 175°C
• Grade Automotive
• Voltage - DC Reverse (Vr) (Max) 160 V
• Voltage - Forward (Vf) (Max) @ If 930 mV @ 2 A
• Current - Reverse Leakage @ Vr 35 µA @ 200 V
• Qualification AEC-Q101
• ECCN EAR99
• HTSUS 8541.10.0080
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant