技术参数

• Package / Case 225-LFBGA
• Mounting Type Surface Mount
• Speed 600MHz
• Program Memory Size 128KB (128K x 8)
• RAM Size 1M x 8
• Operating Temperature 0°C ~ 95°C (TJ)
• Oscillator Type Internal
• Program Memory Type ROM
• Core Processor ARM® Cortex®-M7
• Data Converters A/D 20x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Supplier Device Package 225-MAPBGA (13x13)
• Number of I/O 149
• DigiKey Programmable Not Verified
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant