技术参数

• Package / Case 536-LFBGA
• RAM Size 857.6KB
• Number of I/O MCU - 136, FPGA - 168
• Operating Temperature -40°C ~ 125°C (TJ)
• Core Processor RISC-V
• Primary Attributes FPGA - 93K Logic Modules
• Connectivity CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Peripherals DMA, PCI, PWM
• Supplier Device Package 536-BGA (16x16)
• Architecture MPU, FPGA
• Flash Size 128KB
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• REACH Status REACH Unaffected