技术参数

• Package / Case 80-XFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 100MHz, 150MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 288K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• EEPROM Size 32K x 8
• Core Processor ARM® Cortex®-M0+, ARM® Cortex®-M4F
• Data Converters A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b
• Core Size 32-Bit Dual-Core
• Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
• Connectivity FIFO, I2C, LINbus, QSPI, SPI, UART/USART, USB
• Peripherals Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, POR, PWM, Temp Sensor, WDT
• Supplier Device Package 80-WLCSP (3.68x3.19)
• Number of I/O 62
• DigiKey Programmable Not Verified
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant