技术参数

• Package / Case 357-BBGA
• Mounting Type Surface Mount
• Speed 50MHz
• Operating Temperature -40°C ~ 95°C (TJ)
• Core Processor MPC860
• Voltage - I/O 3.3V
• Supplier Device Package 357-PBGA (25x25)
• Ethernet 10Mbps (4), 10/100Mbps (1)
• Number of Cores/Bus Width 1 Core, 32-Bit
• Co-Processors/DSP Communications; CPM
• RAM Controllers DRAM
• Graphics Acceleration No
• Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
• ECCN 3A991A2
• HTSUS 8542.31.0000
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH info available upon request
• RoHS Status RoHS non-compliant