技术参数

• Package / Case 2-XDFN
• Mounting Type Surface Mount
• Speed Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr) 33 ns
• Technology Schottky
• Capacitance @ Vr, F 85pF @ 2V, 1MHz
• Current - Average Rectified (Io) 1.5A
• Supplier Device Package 2-DSN (1.4x0.6)
• Operating Temperature - Junction 150°C (Max)
• Voltage - DC Reverse (Vr) (Max) 40 V
• Voltage - Forward (Vf) (Max) @ If 590 mV @ 1.5 A
• Current - Reverse Leakage @ Vr 75 µA @ 40 V
• ECCN EAR99
• HTSUS 8541.10.0080
• Moisture Sensitivity Level (MSL) Vendor Undefined
• REACH Status REACH Unaffected