技术参数

• Package / Case 784-BFBGA, FCBGA
• RAM Size 2.2MB
• Number of I/O MCU - 136, FPGA - 372
• Operating Temperature 0°C ~ 100°C
• Core Processor RISC-V
• Primary Attributes FPGA - 254K Logic Modules
• Connectivity CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Peripherals DMA, PCI, PWM
• Supplier Device Package 784-FCBGA (23x23)
• Architecture MPU, FPGA
• Flash Size 128kB
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant