技术参数

• Package / Case 270-LFBGA
• Mounting Type Surface Mount
• Speed 1.2GHz
• Operating Temperature -40°C ~ 85°C (TA)
• Core Processor XBurst® 2
• Voltage - I/O 1.8V, 3.3V
• Supplier Device Package 270-BGA (12x12)
• Ethernet 10/100/1000Mbps (1)
• USB USB 2.0 OTG (1)
• RAM Controllers LPDDR3
• Graphics Acceleration No
• Display & Interface Controllers DVP, LCD, MIPI-CSI, MIPI-DSI
• Security Features AES, RSA, TRNG, MD5, SHA, SHA2
• Additional Interfaces DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
• ECCN 5A992C SC
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant