技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Speed 300MHz
• Program Memory Size 8MB (8M x 8)
• RAM Size 728K x 8
• Operating Temperature -40°C ~ 150°C (TA)
• Oscillator Type External
• Program Memory Type FLASH
• EEPROM Size 768K x 8
• Core Processor TriCore™
• Data Converters A/D 94x12b SAR, Sigma-Delta
• Core Size 32-Bit Tri-Core
• Voltage - Supply (Vcc/Vdd) 2.97V ~ 5.5V
• Connectivity ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
• Peripherals DMA, WDT
• Supplier Device Package Die
• Number of I/O 169
• DigiKey Programmable Not Verified
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant