技术参数
- Package / Case 61-UFBGA, WLCSP
- Mounting Type Surface Mount
- Interface I2C, SPI
- Type Audio
- Operating Temperature -40°C ~ 85°C (TA)
- Voltage - I/O 1.80V
- Voltage - Core 1.20V
- Clock Rate 150MHz
- Supplier Device Package 61-WLCSP (2.7x4.12)
- ECCN 3A991A2
- HTSUS 8542.39.0001
- Moisture Sensitivity Level (MSL) 1 (Unlimited)
- REACH Status REACH Unaffected
- RoHS Status ROHS3 Compliant
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