技术参数

• Package / Case 113-VFBGA
• Mounting Type Surface Mount
• Interface I2C, IrDA, SCI, SPI, UART/USART
• RAM Size 16K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Voltage - Supply 1.8V ~ 3.6V
• Controller Series MSP430
• Program Memory Type FLASH (256kB)
• Applications Bluetooth
• Supplier Device Package 113-NFBGA (7x7)
• Number of I/O 87
• DigiKey Programmable Not Verified
• ECCN EAR99
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant