技术参数

• Package / Case 114-UFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 300MHz
• RAM Size 4.5M x 8
• Operating Temperature -20°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type External Program Memory
• Core Processor ARM® Cortex®-M33
• Data Converters A/D 12x12b SAR
• Core Size 32-Bit Dual-Core
• Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
• Connectivity EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
• Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Supplier Device Package 114-WLCSP (4.24x4.24)
• Number of I/O 65
• DigiKey Programmable Not Verified
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant