技术参数

• Package / Case 256-BGA
• Mounting Type Surface Mount
• Speed 200MHz
• RAM Size 80K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type ROMless
• Core Processor ARM9®
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 1.71V ~ 1.89V, 2V ~ 2.2V
• Connectivity EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
• Peripherals AC'97, DMA, LCD, POR, PWM, WDT
• Supplier Device Package 256-BGA (17x17)
• Number of I/O 60
• DigiKey Programmable Not Verified
• ECCN EAR99
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• RoHS Status ROHS3 Compliant