技术参数

• Package / Case 552-FBGA
• Mounting Type Surface Mount
• Speed 1.2GHz
• Operating Temperature -40°C ~ 85°C (TA)
• Core Processor ARM® Cortex®-A53
• Supplier Device Package 552-FBGA (21x21)
• Ethernet 10/100Mbps (1), 100/1000Mbps (1)
• USB USB 2.0 (1), USB 3.0 (1)
• Number of Cores/Bus Width 2 Core, 64-Bit
• Co-Processors/DSP Multimedia; NEON™ MPE
• RAM Controllers DDR3L
• Graphics Acceleration No
• Display & Interface Controllers MIPI-CSI
• Additional Interfaces CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant