技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Speed No Recovery Time > 500mA (Io)
• Reverse Recovery Time (trr) 0 ns
• Technology SiC (Silicon Carbide) Schottky
• Capacitance @ Vr, F 150pF @ 1V, 1MHz
• Current - Average Rectified (Io) 4A
• Supplier Device Package Sawn on foil
• Operating Temperature - Junction -55°C ~ 175°C
• Voltage - DC Reverse (Vr) (Max) 600 V
• Voltage - Forward (Vf) (Max) @ If 1.9 V @ 4 A
• Current - Reverse Leakage @ Vr 200 µA @ 600 V
• ECCN EAR99
• HTSUS 8541.10.0080
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant