技术参数

• Package / Case Die
• Diode Type PIN - Single
• Operating Temperature 175°C (TJ)
• Capacitance @ Vr, F 0.03pF @ 10V, 1MHz
• Resistance @ If, F 3Ohm @ 20mA, 1GHz
• Voltage - Peak Reverse (Max) 205V
• Supplier Device Package Chip
• Current - Max 10 mA
• Power Dissipation (Max) 400 mW
• ECCN EAR99
• HTSUS 8541.10.0070
• Moisture Sensitivity Level (MSL) 1 (Unlimited)