技术参数

• Package / Case 332-BFBGA, FCBGA
• Mounting Type Surface Mount
• Interface Communications Processor Module (CPM)
• Type SC140 Core
• Operating Temperature -40°C ~ 105°C (TJ)
• Non-Volatile Memory External
• On-Chip RAM 512kB
• Voltage - I/O 3.30V
• Voltage - Core 1.60V
• Clock Rate 275MHz
• Supplier Device Package 332-FCBGA (17x17)
• ECCN 3A001A3
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status Vendor Undefined
• RoHS Status RoHS non-compliant