技术参数

• Package / Case 396-BBGA
• Mounting Type Surface Mount
• Speed 400MHz
• Operating Temperature 0°C ~ 85°C (TC)
• Core Processor AMD Geode™ GX
• Voltage - I/O 3.3V
• Supplier Device Package 396-TEPBGA (35x35)
• Number of Cores/Bus Width 1 Core
• RAM Controllers DDR
• Graphics Acceleration Yes
• Display & Interface Controllers TFT, VGA
• Additional Interfaces PCI
• ECCN 3A991A2
• HTSUS 0000.00.0000
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Affected
• RoHS Status RoHS non-compliant