技术参数

• Package / Case 603-BFCPGA
• Mounting Type Through Hole
• Speed 2GHz
• Operating Temperature 70°C (TC)
• Core Processor Intel® Xeon® Processor
• Voltage - I/O 1.5V
• Supplier Device Package 603-mPGA (53.34x53.34)
• Number of Cores/Bus Width 1 Core, 32-Bit
• Graphics Acceleration No
• ECCN 3A991A2
• HTSUS 0000.00.0000
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status Vendor Undefined
• RoHS Status Not applicable