技术参数

• Package / Case 1356-BBGA, FCBGA
• Mounting Type Surface Mount
• Speed 600MHz
• Operating Temperature -40°C ~ 85°C
• Core Processor Intel® IXP2400
• Voltage - I/O 3.3V
• Supplier Device Package 1356-FCBGA (37.5x37.5)
• Number of Cores/Bus Width 1 Core, 32-Bit
• RAM Controllers DDR SDRAM, SRAM
• Graphics Acceleration No
• Display & Interface Controllers LVDS
• Additional Interfaces PCI, SPI, UART
• ECCN 5A991
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant