技术参数

• Package / Case 432-BGA Exposed Pad
• Speed 300MHz
• Operating Temperature 0°C ~ 85°C (TC)
• Core Processor x86
• Connectivity Access.bus, GPIO, PC/AT, UART
• Peripherals AC97/AMC97, DMA, PCI, SmartCard, WDT
• Supplier Device Package 432-EBGA (40x40)
• Architecture MPU
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Affected
• RoHS Status RoHS non-compliant