技术参数

• Package / Case 168-BCPGA
• Mounting Type Through Hole
• Speed 66MHz
• Operating Temperature 0°C ~ 85°C (TC)
• Core Processor EMBEDDED IntelDX2™ PROCESSOR
• Voltage - I/O 5V
• Supplier Device Package 168-CPGA (44.45x44.45)
• Number of Cores/Bus Width 1 Core, 32-Bit
• Co-Processors/DSP Intel 387™
• Graphics Acceleration No
• Additional Interfaces EBI/EMI
• ECCN 3A991A2
• HTSUS 8473.30.1180
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status Vendor Undefined
• RoHS Status Not applicable