技术参数

• Package / Case 68-BCPGA Exposed Pad
• Mounting Type Through Hole
• Operating Temperature 0°C ~ 70°C (TA)
• Core Processor AM29C117
• Voltage - I/O 5V
• Supplier Device Package 68-CPGA (29.46x29.46)
• Number of Cores/Bus Width 1 Core, 16-Bit
• Graphics Acceleration No
• ECCN EAR99
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status Vendor Undefined
• RoHS Status RoHS non-compliant