技术参数

• Package / Case 256-LFBGA
• Mounting Type Surface Mount
• Speed 200MHz
• RAM Size 16K x 8
• Operating Temperature -20°C ~ 75°C (TA)
• Oscillator Type External
• Program Memory Type ROMless
• Core Processor SH-3 DSP
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 1.4V ~ 1.6V
• Connectivity EBI/EMI, Ethernet, FIFO, SCI, SIO
• Peripherals DMA, POR, WDT
• Supplier Device Package 256-LFBGA (17x17)
• Number of I/O 24
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant