技术参数

• Package / Case 9-XFBGA, WLCSP
• Mounting Type Surface Mount
• Operating Temperature -55°C ~ 150°C (TJ)
• Technology MOSFET (Metal Oxide)
• FET Type N-Channel
• Current - Continuous Drain (Id) @ 25°C 4.8A (Ta)
• Rds On (Max) @ Id, Vgs 41mOhm @ 3A, 10V
• Power Dissipation (Max) 780mW (Ta), 12.5W (Tc)
• Vgs(th) (Max) @ Id 1.5V @ 250µA
• Supplier Device Package 9-WLCSP (1.48x1.48)
• Drive Voltage (Max Rds On, Min Rds On) 4.5V, 10V
• Vgs (Max) ±20V
• Drain to Source Voltage (Vdss) 60 V
• Gate Charge (Qg) (Max) @ Vgs 45 nC @ 10 V
• Input Capacitance (Ciss) (Max) @ Vds 1160 pF @ 30 V
• ECCN EAR99
• HTSUS 8541.29.0095
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant