技术参数

• Package / Case 208-LQFP Exposed Pad
• Mounting Type Surface Mount
• Speed 200MHz
• Program Memory Size 2.25MB (2.25M x 8)
• RAM Size 256K x 8
• Operating Temperature -40°C ~ 125°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 128K x 8
• Core Processor ARM® Cortex®-R5F
• Data Converters A/D 40x12b; D/A 2x10b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 1.1V ~ 5.5V
• Connectivity CANbus, CSIO, FlexRay, LINbus, SPI, UART/USART
• Peripherals DMA, LVD, POR, PWM, WDT
• Supplier Device Package 208-TEQFP (28x28)
• Number of I/O 125
• DigiKey Programmable Not Verified
• HTSUS 0000.00.0000
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant