Technical Details

• Package / Case 16-XFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 16MHz
• Program Memory Size 16KB (16K x 8)
• RAM Size 2K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M0
• Data Converters D/A 1x7b, 1x8b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 1.71V ~ 5.5V
• Connectivity I2C
• Peripherals Brown-out Detect/Reset, POR, PWM, WDT
• Supplier Device Package 16-WLCSP (1.45x1.56)
• Number of I/O 12
• DigiKey Programmable Not Verified
• ECCN 3A991A3
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant