Technical Details

• Package / Case 64-DIP (0.750", 19.05mm)
• Mounting Type Through Hole
• Speed 10MHz
• Program Memory Size 24KB (24K x 8)
• RAM Size 3K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type External
• Program Memory Type Mask ROM
• Core Processor F²MC-8L
• Data Converters A/D 8x8b
• Core Size 8-Bit
• Voltage - Supply (Vcc/Vdd) 2.2V ~ 6V
• Connectivity EBI/EMI, Serial I/O
• Peripherals POR, PWM, WDT
• Supplier Device Package 64-SH-DIP
• Number of I/O 53
• DigiKey Programmable Not Verified
• ECCN OBSOLETE
• HTSUS 0000.00.0000
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant