Technical Details

• Package / Case Die
• Mounting Type Surface Mount
• Speed Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr) 55 ns
• Technology Standard
• Current - Average Rectified (Io) 60A
• Supplier Device Package Wafer
• Operating Temperature - Junction 175°C
• Voltage - DC Reverse (Vr) (Max) 600 V
• Voltage - Forward (Vf) (Max) @ If 2 V @ 60 A
• Current - Reverse Leakage @ Vr 10 µA @ 600 V
• ECCN EAR99
• HTSUS 8541.10.0080