Technical Details
- Package / Case 153-BGA
- Mounting Type Surface Mount
- Memory Size 512Gbit
- Memory Type Non-Volatile
- Operating Temperature -40°C ~ 85°C
- Technology FLASH - NAND (TLC)
- Memory Format FLASH
- Supplier Device Package 153-FBGA (11.5x13)
- Memory Interface eMMC_5.1
- Memory Organization 64G x 8
- DigiKey Programmable Not Verified
- ECCN EAR99
- HTSUS 8542.31.0001
- Moisture Sensitivity Level (MSL) 3 (168 Hours)
- REACH Status REACH info available upon request
- RoHS Status ROHS3 Compliant
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