Technical Details

• Package / Case 784-BFBGA, FCBGA
• RAM Size 857.6KB
• Operating Temperature -40°C ~ 125°C (TJ)
• Core Processor RISC-V
• Primary Attributes FPGA - 93K Logic Modules
• Connectivity CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Peripherals DMA, PCI, PWM
• Supplier Device Package 784-FCBGA (23x23)
• Architecture MPU, FPGA
• Flash Size 128KB
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• REACH Status REACH Unaffected