Technical Details

• Package / Case 306-TFBGA
• Mounting Type Surface Mount
• Speed 1.4GHz
• Operating Temperature 0°C ~ 95°C (TJ)
• Core Processor ARM® Cortex®-A53, ARM® Cortex®-M7
• Supplier Device Package 306-TFBGA (11x11)
• Ethernet GbE
• USB USB 2.0 OTG + PHY (1)
• Number of Cores/Bus Width 3 Core, 64-Bit
• Co-Processors/DSP Multimedia; NEON™ MPE
• RAM Controllers DDR3L, DDR4, LPDDR4
• Graphics Acceleration Yes
• Display & Interface Controllers LCD, MIPI-CSI
• Security Features ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
• Additional Interfaces AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant